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| Advanced Socket Adapter Systems | Location：HOME >> Products >> Detail： |
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| Introduction |
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.
The Solder Ball Advantage
Advanced's exclusve solder ball terminal design provides a stronger solder joint while compensating for minor coplanarity issues on the PC board surface. In addition to greater elasticity, solder balls provide more solder on each joint than less-effective solder bump terminal designs, ensuring a reliable connection.
Socket Adapter Systems Enable Use of Existing Boards and Profiles with Lead-Free Devices
Our BGA Socket Adapter Systems ease the transition for lead-free device processing. Lead-free devices can be attached to our RoHS Compliant Adapters using the required high temperature reflow and existing boards can be processed with either a standard or high temperature profile depending on which Socket is selected. Our BGA Sockets are available with either Tin/Silver/Copper solder ball terminals for RoHS Compliant applications or eutectic Tin/Lead solder ball terminals for exempt applications. Simply plug the Device/Adapter assembly into the board-mounted socket after the PC board is processed.
Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available. Sockets and Adapters are provided with protective covers which facilitate automated pick-and-place and protect pins during storage (before & after assembly). (U.S. Patents 7,179,108 and 7,419,398)
0.80mm, 1.0mm, and 1.27mm Pitch Models
The Solder Ball Advantage
Advanced's exclusve solder ball terminal design provides a stronger solder joint while compensating for minor coplanarity issues on the PC board surface. In addition to greater elasticity, solder balls provide more solder on each joint than less-effective solder bump terminal designs, ensuring a reliable connection.
Use Our Device Attach Service for a Turn-key Solution
An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® BGA Socket Adapter System enables a BGA or LGA device to be plugged into a mating socket after soldering to a pinned adapter. See the SMT Value Added Services page for device attach information.
Socket Adapter Systems Enable Use of Existing Boards and Profiles with Lead-Free Devices
Our BGA Socket Adapter Systems ease the transition for lead-free device processing. Lead-free devices can be attached to our RoHS Compliant Adapters using the required high temperature reflow and existing boards can be processed with either a standard or high temperature profile depending on which Socket is selected. Our BGA Sockets are available with either Tin/Silver/Copper solder ball terminals for RoHS Compliant applications or eutectic Tin/Lead solder ball terminals for exempt applications. Simply plug the Device/Adapter assembly into the board-mounted socket after the PC board is processed.
- Protects valuable PC boards by eliminating damage when devices need to be removed.
- Subjects device to lower thermal stress.
- Low insertion force design provides yields that are equivalent to direct attach, with coplanarity consistently better than the industry standard of .006/(0.152mm).
- Same footprint as BGA or LGA device.
- Over 1,000 footprints available from 1.27mm down to 0.50mm pitch.
- Multi-finger, high reliability contacts and screw-machined terminals for superior reliability.
- Value-added features such as solder balls and tape and reel packaging reduce processing and application costs.
- Available in 0.50mm, 0.65mm, 0.80mm, 1.0mm, and 1.27mm pitch.
- Choose from Lead-free or eutectic Tin/Lead solder ball terminals.
- Available in tape and reel packaging for automated assembly.
0.50mm and 0.65mm Pitch Models
The micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern - offering the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, this compact design is perfect for development and validation of BGA and LGA devices, production level socketing, and SMT board to board connector applications.Unique alignment pins protect pin field and aid in hand placement with optional stand-offs available. Sockets and Adapters are provided with protective covers which facilitate automated pick-and-place and protect pins during storage (before & after assembly). (U.S. Patents 7,179,108 and 7,419,398)
0.80mm, 1.0mm, and 1.27mm Pitch Models
Our compact Socket Adapter System is available in a variety of configurations to suit virtually any application, including standard, extraction slot, male to male, and SMT adapters for connecting to an LGA device or a PC board for use as a high density board to board connector.
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